Amkor Stock Surges 17% After $1.5 Billion Nvidia AI Packaging Partnership

Amkor Technology (NASDAQ: AMKR) shares surged 16.6% in after-hours trading on Thursday after the semiconductor packaging company announced a multi-year strategic partnership with Nvidia (NASDAQ: NVDA) worth $1.5 billion to expand advanced chip packaging and testing technologies for artificial intelligence (AI) and accelerated computing.

The agreement includes a prepayment from Nvidia that will help fund the expansion of Amkor’s advanced semiconductor packaging capacity in the United States. The collaboration will focus on developing next-generation packaging technologies, including high-density interconnects and advanced heterogeneous integration, as demand for AI chips and computing infrastructure continues to accelerate.

As part of the deal, Amkor will strengthen its turnkey advanced packaging and testing capabilities in the U.S., with Nvidia’s capacity commitment supporting the company’s manufacturing expansion in Arizona. The move complements Amkor’s existing operations across Asia, creating a more geographically diversified and resilient semiconductor supply chain.

Nvidia Executive Vice President of Operations Debora Shoquist said the rapid growth of AI is reshaping industries worldwide and creating a significant opportunity to strengthen U.S. manufacturing and supply chains. She added that Amkor’s global manufacturing expertise, combined with its investment in U.S. production, will play a key role in building reliable AI infrastructure and accelerating the deployment of next-generation technologies.

Amkor has been a long-standing packaging partner for Nvidia, providing advanced semiconductor packaging solutions for products including AI data center processors, networking chips, and accelerated computing platforms. The expanded agreement is designed to help both companies bring new AI technologies to market more efficiently and at greater scale.

Amkor Chief Executive Officer Kevin Engel said the partnership highlights the growing importance of advanced semiconductor packaging in the AI era. He noted that the collaboration supports the company’s long-term technology roadmap while expanding U.S. manufacturing capabilities to meet increasing demand for AI infrastructure and advanced semiconductor solutions.