Nvidia’s supplier agreements target substrate capacity at 2.5 times current levels over three years, while Amkor plans a separate packaging expansion as Nvidia’s quarterly revenue more than doubled.
On Oct. 21, Nvidia said agreements with Samsung Electro-Mechanics, IBIDEN and Unimicron would support its three-year substrate-capacity goal. The target is a total capacity level equal to 2.5 times the current base. EconoTimes previously covered Nvidia’s supplier agreements targeting higher substrate capacity.
A package substrate provides an electrical path between a semiconductor chip and a circuit board. Samsung Electro-Mechanics said deliveries under its agreement were scheduled to begin in 2026 and projected double-digit annual growth in shipment volume over multiple years. It also expects Nvidia-allocated capacity to account for a significant share of its annual package-substrate production by 2028, but gave no exact share.
For the fiscal second quarter that ended July 26, 2026, Nvidia recorded $96.2 billion in revenue, 106% above the year-earlier period. Its Data Center business generated $89 billion, up 117% year over year. Nvidia founder and CEO Jensen Huang said, “Demand is extraordinary. Capacity is the constraint.”
Nvidia also described a separate Amkor target: advanced-packaging capacity is expected to grow by more than 300%, with the expansion planned through the end of 2028. That goal concerns packaging capacity, while Nvidia’s 2.5-times target applies to substrate capacity.
