Bank of America Maintains Forecast for Two Fed Rate Cuts in 2026 Despite Inflation Risks 
Asia FX Weekly Gains Hold Amid U.S. Inflation Data and Iran Ceasefire Uncertainty 
Kia Cuts EV Sales Target for 2030 Amid Slowing Demand and U.S. Policy Shifts 
TSMC Posts Strong Q1 2025 Revenue, Riding AI Chip Demand Wave 
Trump Slams Iran Over Strait of Hormuz Oil Restrictions Amid Fragile Ceasefire 
U.S. Futures Slip as Iran Ceasefire Uncertainty and CPI Data Weigh on Markets 
U.S. Automakers Push Back Against EU Rules Blocking American Trucks from European Market 
Foreign Investors Pour $18.65 Billion into Japanese Stocks Amid Market Stabilization 
FedEx Pilots and Union Reach Tentative Agreement on 40% Pay Increase 
Goldman Sachs, ANZ Cut Oil Forecasts Amid U.S.-Iran Ceasefire Hopes 
Alibaba Shares Slide as Jefferies Slashes Price Target Over AI Spending and Business Losses 
Japan Consumer Confidence Drops Sharply Amid Rising Fuel Costs and Middle East Tensions 
BHP's Incoming CEO Visits China Amid Pricing Dispute with CMRG 
BCA Research Warns U.S.-Iran Ceasefire Could Collapse, Maintains Cautious Equity Outlook 
Chinese Brands Are Taking Over Brazil — And It's Just Getting Started 
Dollar Stabilizes Amid Fragile US-Iran Ceasefire as Markets Watch Hormuz Strait 
Pilots Fear Retaliation for Refusing Middle East Flights Amid Ongoing Conflict 
Samsung Electronics vice-chairman Lee Jae Yong has recently met up with Intel's chief executive officer, Pat Gelsinger, to talk about cooperation in their chip businesses. It was reported that the two agreed to join hands and catch up with their rivals, such as the Taiwan Semiconductor Manufacturing Company (TSMC).
On Monday, May 30, the company chiefs held a meeting at Samsung Elec's headquarters in Seoul, and they discussed things related to chipmaking and chip development for the next generation. Lee and Gelsinger will forge a chip alliance, and industry analysts said that this would allow the South Korean company to move in and race against its bigger rival in the business, which is the Taiwanese chip firm, the TSMC.
Samsung and Intel are also looking into potential partnerships for designing and production of the next-generation semiconductors. The conference was held in the midst of the aggressive competition to stay ahead in the chip technology business for the chips designed for the future.
It was also noted that the meeting was held not long after US President Joe Biden's visit to the Korean chipmaker's semiconductor plant in the country.
"Vice Chairman Lee and Gelsinger had a number of meetings to share views on the collaboration in different areas, such as next-generation memory chips, system-on-chips, foundry, PC and mobile," Samsung Elec stated regarding the conference.
As per Korea Joongang Daily, many executives were also present in the meeting, and they were Dr. Kye Hyun Kyung, head of Samsung Electronics Device Solutions Division; Roh Tae Moon, president and head of the Samsung's Mobile eXperience (MX) business unit; and Lee Jung Bae, chief of Samsung's the memory business.
It was mentioned that it is the company's Device Solutions unit that is operating its memory, foundry, and system-on-chip business divisions. The other officials who were present at the meeting include Dr. Choi Si Young, president and general manager of the foundry business in Samsung Electronics' Device Solutions, and Park Yong In, current president of the foundry's System LSI business that designs image sensors and system-on-chips.
