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Snapdragon 898 and Dimensity 2000 specs leak, chipmakers to reportedly use 4nm process from Samsung and TSMC

Photo credit: Kārlis Dambrāns / Flickr licensed under Creative Commons (CC BY 2.0)

Qualcomm and MediaTek are anticipated to reveal their latest flagship mobile SoCs that are expected to be named Snapdragon 898 and Dimensity 2000, respectively. Their core specifications might have been revealed in a recent leak, and the latter appears to have a slight advantage.

The latest information on the Snapdragon 898 and Dimensity 2000 comes from Weibo’s notable leaker Digital Chat Station. In a new post on the Chinese microblogging platform (translated via Google Translate), the tipster claims to have the “current sample parameters” for both chipsets.

Unsurprisingly, the flagship SoCs are rumored to be produced by different manufacturers. Qualcomm is expected to use Samsung’s 4nm process for the Snapdragon 898. MediaTek will also use a 4nm architecture for the Dimensity 2000, but its production will be reportedly handled by the Taiwan Semiconductor Manufacturing Company (TSMC).

Both Snapdragon 898 and Dimensity 2000 will purportedly feature a single core of Arm’s high-performance Cortex-X2 clocked at 3.0GHz. Arm introduced the Cortex-X2 last May and promised that it performs 16 percent faster than its predecessor Cortex X1, which is found on both the Snapdragon 888 and MediaTek 1200.

Qualcomm and MediaTek are not changing the architecture of their next flagship chipsets. They both have eight processing cores with a 1-3-4 design. The remaining cores of both chipsets are where the differences can be easily spotted.

The Snapdragon 898 reportedly sports three “big” cores clocked at 2.5GHz, while the Dimensity 2000 has a slightly better performance with three big cores” with 2.85GHz speed. MediaTek’s advantage in the “little” core is slimmer with four 1.8GHz cores compared to Qualcomm’s four 1.79GHz small cores. The companies are also anticipated to launch their new mobile GPUs namely Adreno 730 on Snapdragon and Mali-G710 MC10 on Dimensity.

Devices reportedly powered by the Snapdragon 898 have already leaked through Geekbench tests, suggesting that the SoC’s launch could be happening soon. Qualcomm held a launch event in December 2020 where the Snapdragon 888 was announced. It is then possible for the Snapdragon 898 to be announced before the end of the year.

Meanwhile, if MediaTek follows its previous timeline the Dimensity 2000 could be unveiled at a later time. This year, the company announced the Dimensity 1200, along with Dimensity 1100, in January.

Featured photo by Kārlis Dambrāns on Flickr licensed under Creative Commons (CC BY 2.0)

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