Amkor Technology Korea held a groundbreaking ceremony Oct. 19 for a chip-packaging expansion in Gwangju, tripling its planned investment to 3 trillion won as demand for advanced packaging grows.
South Korea’s Ministry of Trade, Industry and Resources said Amkor announced the revised plan at the ceremony. The spending is planned for 2026 through 2031. A June 30 ministry plan put the company’s investment at 1 trillion won.
Amkor expects the expansion to add about 2,000 jobs, roughly 1,000 more than under its earlier plan. The ministry said rising demand for advanced packaging prompted the company to increase and accelerate its investment. The planned facilities will handle chips for artificial intelligence and high-performance computing.
The project is separate from the semiconductor fabrication plants outlined in the government’s June 30 plan. That plan calls for Samsung Electronics and SK hynix to develop two plants each in South Korea’s southwest.
The ministry targets completion of two Amkor buildings in the second half of 2027 and two more in the first half of 2028. Mass production is also a stated project target.
