South Korean chipmaker DeepX says its next AI processor is moving toward fabrication on Samsung Electronics’ 2-nanometer process, with first silicon expected in March 2027.
DeepX said it completed the DX-M2 tape-out, handing the design over for fabrication. The company expects first silicon in March 2027, followed by customer evaluation samples in Q2 and initial production shipments in Q4. Full-scale production is planned for 2028.
Those dates mark separate steps: the first silicon run comes before samples intended for customer evaluation, and the initial shipments precede the planned full-scale production phase. The schedule gives prospective customers a chance to assess the processor before production deliveries begin.
Bloomberg reported that development spending will exceed $100 million. The report said the estimate covers chip performance testing and engineering work to prepare production. DeepX outlined the design and schedule, while Bloomberg reported the spending estimate.
DeepX is positioning the processor for robots, industrial machinery and personal computers with AI features. The chip is intended to run AI models locally on a device, without sending that work to remote data centers. DeepX says local processing is meant to lower energy use and costs, and reduce delays as data moves between devices and cloud systems.
First silicon in March 2027 is the next reported milestone. Customer evaluation samples are scheduled for Q2 2027, initial production shipments for Q4, and full-scale production for 2028.
