BOULDER, Colo., April 05, 2018 -- Today, Frustum, the leader in functional generative design, announced the commercial availability and latest release of its patent-pending core technology, TrueSOLID™. Built to help designers and engineers deliver better products faster with fewer errors and lower costs, the technology works alongside traditional CAD to drive 3D manufacturing that operates at pace with the emerging on-demand economy.
A first in the industry, Frustum’s TrueSOLID volumetric geometry kernel allows for the blending of indeterminate generative geometry to traditional surface-based CAD with engineering precision, enabling additive and other manufacturing techniques to realize their full potential. In addition to creating high quality designs that deliver weight and material savings, this one-of-a-kind technology allows for manual and procedural modeling of highly complex mechanical parts that have manufacturability built in.
Included in the new version of TrueSOLID are the following enhancements:
- Multi-part assembly optimization
- New optimization modes
- Kernel-integrated mesostructures (lattices)
“The TrueSOLID volumetric geometry kernel was designed to be a fundamental component of next generation 3D design software and to enable design for additive manufacturing. The intention is to bring about the transformation of CAD design from deterministic to generative,” says Jesse Coors-Blankenship, CEO and Founder, Frustum. “Moving towards a single-click solution for product design, our technology grants engineers and designers the freedom to reimagine how parts can be designed for a new generation of complex products made with 3D manufacturing.”
TrueSOLID is the underlying technology powering Generate®, Frustum’s flagship product that provides control over complex geometry, handling intricate and rugged designs and workflows that support additive manufacturing, milling and casting. The technology is currently being commercially licensed to Siemens PLM software, serving Siemens NX and Siemens SolidEdge customers.
As a leading player in the additive manufacturing industry, Frustum is attending and exhibiting at Rapid + TCT 2018 in Fort Worth, Texas from April 23-26th. At the conference, members of the team will be available for conversations and demonstrations of its core technology and product at Booth #2523.
To learn more about Frustum’s TrueSOLID geometry kernel, request a demo today: https://www.frustum.com/request-demo
About TrueSOLID
TrueSOLID™ is the only commercial geometry kernel in the industry that can generate ready to manufacture topology optimized designs including mesostructures (lattices) and manufacturing constraints, eliminating the need and cost of part redesign resulting in significant savings in weight and design time. Powering Frustum’s flagship product, Generate®, TrueSOLID enables users to capture manufacturing intent early in the design process and output designs optimized for additive manufacturing.
About Frustum Inc.
Frustum empowers engineers to push the boundaries of what’s possible by combining the power of generative design with precision engineering. Through its flagship product, Generate®, Frustum makes generative design truly functional, enabling users to create manufacture-ready parts and products with optimally balanced performance, structural strength, and weight in a fraction of the time it would traditionally take them with CAD alone.
Press Contact Devan Bahr [email protected] 617-945-0708


Google Changes EU Spam Policy Amid Antitrust Scrutiny
Trump Administration Plans New Drug Pricing Deals With Biotech Firms
U.S. Probes Apex Logistics Over Nvidia AI Chip Shipments to China
BNP Paribas, KB Kookmin Eye $2 Billion Techcombank Stake
The Realist’s Case: Lukas Kerrebijn of RD Dubai on the Narrative Dubai’s Agents Won’t Question
Nvidia Pauses AI Cloud Financing Deals Amid Antitrust Concerns
SK Biopharmaceuticals Secures Global Rights to Biohaven Epilepsy Drug Opakalim
HP Stock Drops 9% Despite Q3 Earnings Beat and Raised 2026 Outlook
Honda, Nissan Eye Shared Vehicle Software Platform by 2029
SoftBank Eyes $20 Billion Bond Sale to Refinance OpenAI Loan
Itochu Offers $1.56 Billion to Privatize Dentsu Soken
Jefferies Names AMEC Top China Semiconductor Equipment Pick
BofA Names ASML Top Semiconductor Equipment Pick on Growth, Valuation
Meta Agrees to $18 Billion Settlement, Tightens Teen Social Media Rules
Mercer International Stock Surges 45% on C$20 Million Canada Funding
Street Poller Media and The Boom of the Street Interview Ad Industry
Toyota Global Sales Fall as China Demand Slumps 



