Reverse Costing Analysis of Huawei's Nexus 6P Fingerprint Sensor

Dublin, Feb. 29, 2016 -- Research and Markets (http://www.researchandmarkets.com/research/892jch/nexus_6p) has announced the addition of the "Nexus 6P Fingerprint Sensor - Reverse Costing Analysis" report to their offering.

The Nexus 6P is a smartphone designed and manufactured by Huawei. Like in the Ascend Mate 7, the Chinese company integrates a fingerprint sensor from Fingerprint Cards on the back of the device but introduces significant modifications in term of resolution and packaging.

The FPC1025 has been chosen by different smartphone manufacturers; it can be found also in products from Lenovo, ZTE, QiKU, LG and many others.

SystemPlus Consulting report presents a complete report with teardown technical analysis, manufacturing process, supply chain and manufacturing cost analysis of FPC1025.

Located on the back side of the smartphone, the fingerprint sensor of the Nexus 6P has dimensions of 11.6 x 11.6mm. It is assembled on a square LGA package and is protected by metal support.

The sensor has a resolution of 15,600 pixels with a pixel density of 508ppi. It uses a capacitive touch technology to takes an image of the fingerprint from the subepidermal layers of the skin.

The sensor die is manufactured with CMOS 65nm technology and is connected by mean of wire bonding to the rigid PCB.

The components also includes an ASIC die manufactued using a 0.5µm CMOS process and connected to the flex PCB.

This report includes comparisons with Ascend Mate 7 fingerprint sensor and with the latest Samsung's and Apple's fingerprints buttons.

Key Topics Covered:

1. Introduction

2. Company Profile & Supply Chain

3. Physical Analysis
- Physical Analysis Methodology
- Fingerprint Button assembly
- Fingerprint Scanner Views
- Fingerprint Scanner Croos-Section
- Fingerprint Scanner Patents
- Sensor Die
- Sensor Die View & Dimensions
- Sensor Die Capacitor
- Sensor Die Edge Contact
- Sensor Delayering & main Blocs
- Sensor Die Process
- Sensor Die Cross-Section
- Sensor Die Process Characteristic
- ASIC Die
- Dimensions & Markings
- Delayering
- IC Process
- Die Cross-Section

4. Nexus 6P's vs Ascend Mate 7's fingerprint sensor

5. Manufacturing Process Flow
- Sensor Die Front-End Process
- LGA Packaging Process
- Sensor Die Front-End Process
- Final Test & Packaging
- Fabrication unit
- Synthesis of the main parts

6. Cost Analysis
- Sensor Die Front-End Cost, Probe Test, Thinning & Dicing
- LGA Packaging Cost
- Sensor Component Cost
- ASIC Die Front-End Cost, Probe Test, Thinning & Dicing
- ASIC Component Cost
- Assembled Components Cost
- Synthesis of the assembling
- Fingerprint Component Cost

For more information visit http://www.researchandmarkets.com/research/892jch/nexus_6p

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