Samsung, SK Hynix Test AMEC Chipmaking Tools for China Backup Plan

Samsung Electronics and SK Hynix have reportedly been evaluating chipmaking equipment from China's Advanced Micro-Fabrication Equipment (AMEC) at their manufacturing facilities in China, according to a Reuters report citing people familiar with the matter. The testing, which began around two years ago, is part of a contingency strategy rather than a commitment to adopt Chinese semiconductor equipment on a large scale.

The move reflects growing concerns among the South Korean memory chipmakers over tightening U.S. export controls. While Samsung and SK Hynix still rely heavily on Western semiconductor manufacturing equipment, they are exploring alternative suppliers in case future restrictions limit not only new equipment purchases but also access to maintenance services and replacement parts for tools already installed at their Chinese fabrication plants.

The report notes that the evaluations are intended to ensure production continuity in China rather than support capacity expansion. Even if AMEC's equipment performs well, any commercial deployment would require lengthy qualification processes before it could be integrated into high-volume manufacturing.

Washington previously granted Samsung and SK Hynix's China facilities validated end-user status in 2023, allowing imports of certain U.S.-controlled chipmaking equipment without individual licenses. However, that authorization was withdrawn in 2025 before the companies received their annual import licenses for 2026, increasing uncertainty over long-term equipment support.

Industry analysts say the situation highlights an unintended consequence of U.S. semiconductor restrictions. Policies designed to curb China's technological development are encouraging global chipmakers with operations in China to evaluate domestic Chinese equipment suppliers as backup partners.

If AMEC eventually secures supply contracts with Samsung Electronics or SK Hynix, it would mark a significant milestone for China's semiconductor equipment industry and strengthen confidence in its domestic manufacturing capabilities.

Despite the ongoing evaluations, several challenges remain before Chinese chipmaking tools could see broader adoption. These include strict qualification requirements, smaller global service networks, intellectual property considerations, and the possibility of additional political pressure from the United States. For now, Samsung and SK Hynix appear focused on maintaining operational flexibility while safeguarding production at their China-based memory chip plants.