Global PC Makers Eye Chinese Memory Chip Suppliers Amid Ongoing Supply Crunch 
Australia’s December Trade Surplus Expands but Falls Short of Expectations 
Nintendo Shares Slide After Earnings Miss Raises Switch 2 Margin Concerns 
SpaceX Pushes for Early Stock Index Inclusion Ahead of Potential Record-Breaking IPO 
TSMC Eyes 3nm Chip Production in Japan with $17 Billion Kumamoto Investment 
Ford and Geely Explore Strategic Manufacturing Partnership in Europe 
TrumpRx Website Launches to Offer Discounted Prescription Drugs for Cash-Paying Americans 
AMD Shares Slide Despite Earnings Beat as Cautious Revenue Outlook Weighs on Stock 
U.S.-India Trade Framework Signals Major Shift in Tariffs, Energy, and Supply Chains 
Trump Endorses Japan’s Sanae Takaichi Ahead of Crucial Election Amid Market and China Tensions 
Rio Tinto Shares Hit Record High After Ending Glencore Merger Talks 
China Extends Gold Buying Streak as Reserves Surge Despite Volatile Prices 
SpaceX Updates Starlink Privacy Policy to Allow AI Training as xAI Merger Talks and IPO Loom 
Sony Q3 Profit Jumps on Gaming and Image Sensors, Full-Year Outlook Raised 
Oil Prices Slip as U.S.–Iran Talks Ease Supply Disruption Fears 
Oil Prices Slide on US-Iran Talks, Dollar Strength and Profit-Taking Pressure 
Nvidia, ByteDance, and the U.S.-China AI Chip Standoff Over H200 Exports 
Samsung Electro-Mechanics Co. had developed an advanced driver assistance systems (ADAS)-applicable flip chip ball grid array (FCBGA), a substrate for high-performance self-driving systems.
FCBGA is among those with the highest technological levels for automotive electronics.
Samsung Electro-Mechanics applied its microcircuit technology from the areas of high-end IT products, such as servers for automotive electronics, to reduce circuit width and spacing by 20 percent comparedf to existing substrates for partial driving automation.
Accordingly, over 10,000 bumps were realized in a passport photo-sized space.
Samsung Electro-Mechanics also improved flexural strength to cope with multi-chip packages in which several chips are mounted on a single substrate at the same time.
