Aehr Test Systems to Exhibit at SPIE Photonics West 2018 in San Francisco

FREMONT, Calif., Jan. 29, 2018 -- Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced that it will be exhibiting at the SPIE Photonics West 2018 Conference taking place January 30 - February 1 in San Francisco, CA at the Moscone Convention Center (Booth #30).

The Company will be showcasing its solutions for both wafer level and module level burn-in and test of optical devices, including its FOX-XP^TM next generation test and burn-in system for high volume production and early failure rate (EFR) test.

Photonics West is the world’s largest annual event for the photonics, laser, and biomedical optics industries, spanning biophotonics for brain research and healthcare, lasers for research and advanced manufacturing, sensors and camera systems, imaging and displays, communications and optoelectronics, plus the core optical components that enable many of today’s consumer products.

“We continue to be very excited about the silicon photonics and photonics sensors markets and believe they will be significant growth drivers for Aehr Test,” said Gayn Erickson, President and CEO of Aehr Test Systems. “The rapid growth of integrated optical devices in mobile and computing applications, as well as the automotive market, is driving substantially higher requirements for initial quality and long-term reliability. Integrated optical devices in mobile devices, high-performance servers and data centers, and automotive applications are increasing with every new product generation. We believe these new applications are driving an entirely new level of quality and reliability expectation for these systems and pose a significant long-term growth opportunity for the Company."

About Aehr Test Systems
Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in and testing logic, optical and memory integrated circuits and has an installed base of more than 2,500 systems worldwide. Increased quality and reliability needs of the Automotive and Mobility integrated circuit markets are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products in package, wafer level, and singulated die/module level test. Aehr Test has developed and introduced several innovative products, including the ABTS^TM and FOX-P^TM families of test and burn-in systems and FOX WaferPak^TM Aligner, FOX-XP WaferPak Contactor, FOX DiePak^® Carrier and FOX DiePak Loader. The ABTS system is used in production and qualification testing of packaged parts for both lower power and higher power logic devices as well as all common types of memory devices. The FOX-XP system is a full wafer contact and singulated die/module test and burn-in system used for burn-in and functional test of complex devices, such as leading-edge memories, digital signal processors, microprocessors, microcontrollers, systems-on-a-chip, and integrated optical devices. The WaferPak contactor contains a unique full wafer probe card capable of testing wafers up to 300mm that enables IC manufacturers to perform test and burn-in of full wafers on Aehr Test FOX systems. The DiePak Carrier is a reusable, temporary package that enables IC manufacturers to perform cost-effective final test and burn-in of both bare die and modules. For more information, please visit Aehr Test Systems’ website at www.aehr.com.

Contacts:

Aehr Test Systems  
Carl Buck                   
V.P. of Marketing       
(510) 623-9400 x381  
[email protected]       

MKR Group Inc.
Todd Kehrli or Jim Byers
Analyst/Investor Contact
(323) 468-2300
[email protected]