Complete Tear-Down Analysis of Avago's FBAR BAW Mid-Band Filter - AFEM8030

Dublin, April 04, 2016 -- Research and Markets has announced the addition of the "Avago AFEM8030 - FBAR BAW Mid-Band Filter - Complete Tear-Down Analysis" report to their offering.

After a first introduction of Avago's power amplifier in the iPhone 4S and an integration in iPhone 5 series, Apple integrates again Avago's LTE Mid Band Front-End Module in the iPhone 6s series.

With the acquisition of Broadcom (Apple's Wifi FEM first suppliers), Avago becomes a top competitor in wireless communication thanks to its FBAR BAW filter knowledge.

Located on the main board of the smartphone, the Front-End Module of the Apple iPhone 6s Plus for mid-band LTE application is a complete Front-End Module. The component is made with several filter dies, assembled on a coreless PCB substrate.

The filters are hermetically wafer-level packaged with Avago's Microcap bonded-wafer CSP technology allowing the assembly of all components of the Front-End Module on the same chip with an area of less than 35 mm².

TSVs are etched in the cap two times in order to report electrical contacts. Also specific milling steps in FBAR fabrication give control of the AlN thickness.

Thanks to its design and manufacturing process, Avago device is very accurate and cost effective in respect to competitors.

The report includes comparisons with the BAW filter from Qorvo, also found in the Apple iPhone 6s Plus and the evolution of Avago's BAW filters since 2013.

Key Topics Covered:

1. Overview / Introduction

2. Company Profile & Supply Chain

3. iPhone 6s Plus Teardown

4. Physical Analysis
- Physical Analysis Methodology
- Front-End Module Package
-- Front-End Module Views
-- Front-End Module Cross-Section
- Front-End Module Dies
-- Active device Dies View & Dimensions
- SAW filter Die
-- SAW filter Die View & Dimensions
-- SAW filter Die details
-- SAW filter Die cross section
- FBAR BAW filter Die
-- BAW filter Die View & Dimensions
-- BAW filter Die Opening
-- BAW filter Die cap details
-- BAW filter Die resonators
-- BAW filter Die Cross-section
-- BAW filter Die TSVs
-- BAW filter Die Au/Au Bonding
-- BAW filter Die membrane

5. Manufacturing Process Flow
- Component Packaging
- MEMS FBAR Fabrication unit
- MEMS FBAR wafer process flow
-- FBAR process Flow
-- Cap process flow
-- Bonding & TSVs process flow
- FBAR Final Test & Packaging

6. Cost Analysis
- FBAR BAW Filter Wafer Front-End Cost
- FBAR BAW Filter Wafer Front-End Cost per process
- FBAR BAW Filter Front-End Probe Test, Thinning & Dicing Cost
- FBAR BAW filter Die Cost
- Estimated Manufacturer Price

For more information visit http://www.researchandmarkets.com/research/dn9dmt/avago_afem8030

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