Entegris completed its acquisition of Advanced Abrasives on Nov. 3, adding a New Jersey supplier of diamond polishing products as it expands materials for advanced chip packaging amid heat-management needs that the company links to AI computing.
TKO Miller said Nov. 9 that it had served as Advanced Abrasives’ exclusive investment banking adviser. The disclosure came six days after Entegris announced the deal’s completion.
Advanced Abrasives makes diamond super-abrasive consumables used to polish hard substrates, Entegris said. The company said the purchase strengthens its silicon carbide chemical mechanical planarization (CMP) business, which includes slurry and pad products, cleaning materials and capabilities for conditioning surfaces. Entegris also cited intellectual property in materials science and surface engineering as part of the expanded business.
Entegris said growth in AI computing is increasing data centers’ need to manage power and heat. “Our goal is to facilitate better heat dissipation without compromising performance or reliability,” Olivier Blachier, Entegris’ president of Materials Solution and senior vice president and chief innovation officer, said in the company’s announcement.
The company plans to add a manufacturing line in Taiwan for silicon carbide solutions and continue exploratory research and development in the United States on next-generation thermal interface materials. Entegris did not provide a timeline or spending figure for those plans.
Separately, Entegris announced a long-term development partnership with Element Six, part of De Beers Group, to explore diamond-based heat management in advanced packaging. The work is intended to cover wafer-level and heterogeneous integration, including 3-D integration, for future logic and memory chips.
Entegris had scheduled an Investor Day in New York for Nov. 9 at 1 p.m. ET, with its thermal-management strategy on the agenda. The acquisition announcements did not disclose the purchase price or other financial terms.
