Roaring Kitty's Cryptic X Post Sparks 28% Surge in Solana-Based CHEWY Memecoin 
브로드컴, 매출 전망 실망에 7% 급락 
Murdoch to Musk: how global media power has shifted from the moguls to the big tech bros 
Ripple CEO Brad Garlinghouse Predicts Yen-Pegged Stablecoin Boom in Japan’s Crypto Market 
Talaria MX5 Electric Dirt Bike Faces First Documented Battery Fire in U.S., Luna Cycle Responds 
Bill Gates Reveals His Favorite ChatGPT Feature While Cautioning About AI’s Threat to Society 
Shiba Inu Whale Ignites 250 Million SHIB Burn as Burn Rate Explodes 1,664% in 24 Hours 
The Boeing Starliner has returned to Earth without its crew – a former astronaut details what that means for NASA, Boeing and the astronauts still up in space 
Mark Gurman’s Final iPhone 16 Predictions Ahead of Apple’s 'Its Glowtime' Launch Event 
도요타와 닛산, 중국 및 한국과 경쟁하기 위해 일본의 전기차 배터리 생산 능력 확대 
Snapdragon 8 Gen 4’s 21% Price Hike Could Make Flagship Smartphones Even More Expensive 
Elon Musk Denies Tesla Licensing xAI AI Models for Full Self-Driving Development 
Telegram Game 'Catizen' Surpasses 800K Paying Users in Six Months, Dominating Clicker Games 
Solana (SOL) Faces Potential $90 Price Drop, as Market Prediction Warns of Bearish Trend 
스페이스X, 팰컨 9으로 21기 위성 발사 성공… 스타링크 7000기 돌파 
코인베이스, SEC 관련 위험에 대한 주주 소송 직면해야 
Bitcoin Rally Imminent, Says Arthur Hayes After Closing Short Position Due to Market Shift 
Huawei's bold move to adopt a unified architecture for its Kirin PC chips could challenge Apple's M-Series, integrating SoC and DRAM for unmatched performance.
Unified Memory Architecture Explained
With the integration of the system on chip (SoC) and dynamic random access memory (DRAM) into a single package, rumors suggest that Huawei will use this architecture in its Kirin PC chip. We have covered the benefits of this adjustment below, so keep reading to discover out.
Various components of a conventional CPU package are soldered to various parts of the motherboard. The system on a chip (SoC) and dynamic random access memory (DRAM) are integrated into one die in a unified memory architecture, which greatly improves the speed of communication between the two components.
Benefits of Closer Integration
Data transfer times and power consumption are both affected by the proximity of DRAM chips to the central processing unit and graphics processing unit.
The first Kirin PC chip from Huawei will introduce itself to remove this bottleneck, according to a rumor posted on X by @jasonwill101.
The proximity of the DRAM to the SoC in a unified memory architecture also provides high bandwidth to the chipset, which is an additional perk of this design.
This will enable the Central Processing Unit, Graphics Processing Unit, and Neural Processing Unit to swiftly access large data sets. Machines equipped with these chips may also never experience a memory leak while doing operations that necessitate coordinated processing by the CPU and GPU, thanks to this method.
There is no physical means to upgrade the DRAM chips since they are baked onto the packaging, which is the major downside.
Rivaling Apple’s M-Series Performance
Rumor has it that Huawei's first Kirin PC chip will have remarkable first performance claims, nearly matching Apple's M3 in multi-core capabilities. However, it doesn't say how many memory tiers the chip would have.
