SK hynix Inc. has partnered with Taiwan Semiconductor Manufacturing Co. (TSMC) to become a major player in the artificial intelligence (AI) chip industry. The new deal will bolster the companies’ partnership in the semiconductor business.
Formation of One Team
As per Pulse News, SK hynix and TSMC’s AI chip collaboration is being seen as a move to show a united front against their rival, Samsung Electronics Co. As part of the deal, the South Korean chipmaker launched the “One Team Strategy” with its Taiwan-based partner.
SK Hynix and TSMC will also collaborate to develop the sixth-generation high-bandwidth memory (HBM) called HBM4. The former is a leading player in the HBM industry, and the latter is the largest chip foundry in the world. Thus, there are high hopes for this new cooperation amid the increasing popularity of AI.
“The collaboration between SK hynix and TSMC is expected to be a driving force in the growing AI semiconductor market,” Ahn Ki Hyun, the executive director of the Korea Semiconductor Industry Association, commented.
Strategic Plan for AI Chip
The strategic team-up aims to combine the positions and respective expertise of the companies in the AI chip market. SK hynix and TSMC are expanding their presence and influence in their specific markets by merging their technical prowess in the next-generation AI chip packaging.
Meanwhile, Business Korea reported that this partnership is expected to commence with TSMC managing some of the processes for the HBM4.
“The importance of packaging in next-generation AI semiconductors is increasing,” an official in the chip industry said. “The cooperation between these two leading companies will have a significant impact.”
An analyst at Hyundai Motor Securities, Kwak Min Jeong, also said via Korea’s Digital Daily, “In the future, SK Hynix will be responsible for packaging and production centered on HBM through the Indiana fab and TSMC will carry out the CoWoS packaging process including GPU at the Arizona fab, and then supply it to US hyperscaler companies.”
Photo by: Igor Omilaev/Unsplash


Apple Leads Singles’ Day Smartphone Sales as iPhone 17 Demand Surges
IKEA Expands U.S. Manufacturing Amid Rising Tariffs and Supply Chain Strategy Shift
Hikvision Challenges FCC Rule Tightening Restrictions on Chinese Telecom Equipment
Amazon and Google Launch New Multicloud Networking Service to Boost High-Speed Cloud Connectivity
Banks Consider $38 Billion Funding Boost for Oracle, Vantage, and OpenAI Expansion
Apple Appoints Amar Subramanya as New Vice President of AI Amid Push to Accelerate Innovation
Microchip Technology Boosts Q3 Outlook on Strong Bookings Momentum
YouTube Agrees to Follow Australia’s New Under-16 Social Media Ban
Trump Administration to Secure Equity Stake in Pat Gelsinger’s XLight Startup
Nexperia Urges China Division to Resume Chip Production as Supply Risks Mount
Wikipedia Pushes for AI Licensing Deals as Jimmy Wales Calls for Fair Compensation
ExxonMobil to Shut Older Singapore Steam Cracker Amid Global Petrochemical Downturn
Apple Alerts EU Regulators That Apple Ads and Maps Meet DMA Gatekeeper Thresholds
UPS MD-11 Crash Prompts Families to Prepare Wrongful Death Lawsuit
Momenta Quietly Moves Toward Hong Kong IPO Amid Rising China-U.S. Tensions
AI-Guided Drones Transform Ukraine’s Battlefield Strategy
Australia Moves Forward With Teen Social Media Ban as Platforms Begin Lockouts 



