Rewardy Wallet and 1inch Collaborate to Simplify Multi-Chain DeFi Swaps with Native Token Gas Payments 
OpenAI Reportedly Eyes Late-2026 IPO Amid Rising Competition and Massive Funding Needs 
Google Halts UK YouTube TV Measurement Service After Legal Action 
ASML’s EUV Lithography Machines Power Europe’s Most Valuable Tech Company 
Meta Faces Lawsuit Over Alleged Approval of AI Chatbots Allowing Sexual Interactions With Minors 
Federal Judge Signals Possible Dismissal of xAI Lawsuit Against OpenAI 
China Approves First Import Batch of Nvidia H200 AI Chips Amid Strategic Shift 
Sandisk Stock Soars After Blowout Earnings and AI-Driven Outlook 
Elon Musk’s Empire: SpaceX, Tesla, and xAI Merger Talks Spark Investor Debate 
SpaceX Updates Starlink Privacy Policy to Allow AI Training as xAI Merger Talks and IPO Loom 
Oracle Plans $45–$50 Billion Funding Push in 2026 to Expand Cloud and AI Infrastructure 
Disney Board Nears CEO Decision as Josh D’Amaro Emerges as Leading Candidate 
Trump Threatens Aircraft Tariffs as U.S.-Canada Jet Certification Dispute Escalates 
Pentagon and Anthropic Clash Over AI Safeguards in National Security Use 
Microsoft AI Spending Surge Sparks Investor Jitters Despite Solid Azure Growth 
SpaceX Reports $8 Billion Profit as IPO Plans and Starlink Growth Fuel Valuation Buzz 
Nvidia’s $100 Billion OpenAI Investment Faces Internal Doubts, Report Says 
Samsung Electronics denied on Friday that its high-bandwidth memory chips had yet to pass Nvidia's tests for use in the US semiconductor giant's AI systems.
Nvidia's Approval Process Faces Delays
In an exclusive report by Reuters, it has been revealed that Nvidia still needs to approve Samsung's HBM3 processors, which cannot be used in Nvidia's AI processors. The heat and power problems seen in HBM3 chips are also happening with the HBM3E chips.
"The problems affect Samsung's HBM3 chips, which are the fourth-generation HBM standard currently most used in graphics processing units for artificial intelligence, as well as fifth-generation HBM3E chips that the South Korean tech giant and its rivals are bringing to market this year," according to the report.
The results of Samsung's 8-layer and 12-layer HBM3E chips were released in April 2024. While Samsung's HBM3 chips continue to fail, sources claim that SK Hynix began supplying HBM3E chips to Nvidia in March 2024.
Samsung's Commitment to Quality
"We are currently working closely with multiple companies and continuously testing technology and performance," the Korean tech giant said. "We are conducting various tests to thoroughly verify the quality and performance of HBM."
Samsung reiterated its unwavering commitment to enhancing the quality and reliability of its products. This commitment aims to provide consumers with the best possible solutions and instill optimism about the company's future in the semiconductor industry.
Samsung's Strategic Leadership Changes
According to The Korea Herald, Samsung made a significant leadership change on Tuesday as part of its strategic moves in the AI battle.
Co-CEO Kyung Kye-hyun, a seasoned veteran, was replaced as head of semiconductors by vice chairman Jun Young-hyun, a move that underscores the company's strong determination to enhance its future competitiveness.
Last month, Samsung started mass-producing eight-layer HBM3E chips. They aim to reach 12-layer devices in the second quarter.
