Apple App Store Injunction Largely Upheld as Appeals Court Rules on Epic Games Case 
SK Hynix Considers U.S. ADR Listing to Boost Shareholder Value Amid Rising AI Chip Demand 
Samsung SDI Secures Major LFP Battery Supply Deal in the U.S. 
Adobe Strengthens AI Strategy Ahead of Q4 Earnings, Says Stifel 
Microsoft Unveils Massive Global AI Investments, Prioritizing India’s Rapidly Growing Digital Market 
Australia’s Under-16 Social Media Ban Sparks Global Debate and Early Challenges 
Intel’s Testing of China-Linked Chipmaking Tools Raises U.S. National Security Concerns 
Mizuho Raises Broadcom Price Target to $450 on Surging AI Chip Demand 
Taiwan Opposition Criticizes Plan to Block Chinese App Rednote Over Security Concerns 
Trello Outage Disrupts Users as Access Issues Hit Atlassian’s Work Management Platform 
SpaceX Insider Share Sale Values Company Near $800 Billion Amid IPO Speculation 
EU Court Cuts Intel Antitrust Fine to €237 Million Amid Long-Running AMD Dispute 
Trump Criticizes EU’s €120 Million Fine on Elon Musk’s X Platform 
Air Transat Reaches Tentative Agreement With Pilots, Avoids Strike and Restores Normal Operations 
China Adds Domestic AI Chips to Government Procurement List as U.S. Considers Easing Nvidia Export Curbs 
Rio Tinto Signs Interim Agreement With Yinhawangka Aboriginal Group Over Pilbara Mining Operations 
JD.com Pledges 22 Billion Yuan Housing Support for Couriers as China’s Instant Retail Competition Heats Up 
Taiwan Semiconductor Manufacturing Co. (TSMC) has started producing advanced 4-nanometer chips in Arizona, marking a milestone in the Biden administration's semiconductor strategy. U.S. Commerce Secretary Gina Raimondo highlighted this achievement as the first instance of leading-edge chip production on American soil, with quality and yield matching Taiwan's standards.
The $6.6 billion grant from the U.S. Commerce Department to TSMC's Arizona unit underscores the federal push for domestic semiconductor manufacturing. In April, TSMC expanded its investment plans by $25 billion, bringing its total U.S. commitment to $65 billion, including a third Arizona fab set to open by 2030.
TSMC’s second Arizona fab, expected to begin production in 2028, will feature 2-nanometer technology, the world's most advanced. Additionally, the company agreed to deploy its cutting-edge "A16" manufacturing technology in Arizona. The U.S. government also approved up to $5 billion in low-cost loans to support TSMC's efforts.
This initiative aligns with Raimondo’s goal to produce 20% of the world’s leading-edge logic chips domestically by 2030, up from 0% before TSMC’s Arizona operations began.
Separately, Commerce granted $407 million to Amkor Technology to develop a $2 billion advanced semiconductor packaging facility in Arizona. This plant, the largest of its kind in the U.S., will test and package millions of chips for applications like autonomous vehicles, 5G/6G, and data centers. Apple will be a key customer, sourcing chips produced at TSMC’s nearby facility.
These investments are part of a broader $52.7 billion federal program to bolster semiconductor manufacturing and research, securing America's leadership in advanced technology.
