LG Uplus Corp and its global partners have developed cellular module technology using Universal Integrated Circuit Card (iUICC) solutions that do away with Subscriber Identification Module (SIM) cards in mobile devices.
The partners include cellular chipset developer Sony Semiconductor Israel, German digital security solutions provider Giesecke+Devrient, and local communication module maker NTmore.
The latest technology will allow manufacturers to produce smaller devices with the space saved for a SIM card and related components.
The iUICC implements a communication chipset's SIM functionality that is responsible for voice and data connection.
LG Uplus plans to initially use iUICC technology on the Internet of Things products, such as for tracking devices and outdoor inspection equipment.
LG Uplus is South Korea's third-largest mobile carrier.


Federal Judge Clears Way for Jury Trial in Elon Musk’s Fraud Lawsuit Against OpenAI and Microsoft
China Halts Shipments of Nvidia H200 AI Chips, Forcing Suppliers to Pause Production
U.S. Moves to Expand Chevron License and Control Venezuelan Oil Sales
U.S. Transportation Board Sends Union Pacific–Norfolk Southern Merger Back for Revision
Tesla Revives Dojo Supercomputer Project With AI5 Chip at the Core
xAI Restricts Grok Image Editing After Sexualized AI Images Trigger Global Scrutiny
Sanofi Gains China Approval for Myqorzo and Redemplo, Strengthening Rare Disease Portfolio
Micron to Buy Powerchip Fab for $1.8 Billion, Shares Surge Nearly 10%
One Percent Rule Checklist For Safer Forex Trading Risk
BYD Shares Rise in Hong Kong on Reports of Battery Supply Talks With Ford
China Considers New Rules to Limit Purchases of Foreign AI Chips Amid Growing Demand
Jamie Dimon Signals Possible Five More Years as JPMorgan CEO Amid Ongoing Succession Speculation
Baidu Shares Rise in Hong Kong After Apollo Go Robotaxi Launch in Abu Dhabi
Publishers Seek to Join Lawsuit Against Google Over Alleged AI Copyright Infringement
Proposed Rio Tinto–Glencore Merger Faces China Regulatory Hurdles and Asset Sale Pressure 



