Oil Prices Surge as U.S.-Iran Conflict Escalates, Raising Supply Fears 
Wistron Opens $700M Texas AI Factory to Build Nvidia GB300 Superchips 
Morgan Stanley Downgrades Adobe, Workday as AI Transition Raises Growth Concerns 
Gold Price Surges Above $4,100 as Middle East Tensions Boost Safe-Haven Demand 
ASEAN Ministers Warn Middle East Conflict Threatens Regional Stability and Energy Security 
SpaceX Targets Thursday Launch for Starship's 13th Test Flight After Last-Minute Delay 
Germany Producer Prices Rise 1.8% in June, Missing Forecasts 
Alaska Air Q3 Outlook Misses Estimates as Higher Fuel Costs Weigh on Profit Forecast 
Judge Approves Anthropic’s $1.5 Billion AI Copyright Settlement With Authors 
KPMG Australia Appoints John Sams as CEO Following Audit Leak Scandal 
Lockheed Martin Unveils Lower-Cost Patriot ACE Interceptor to Meet Rising Air Defense Demand 
Samsung Cuts U.S. Consumer Electronics Jobs as Headquarters Moves to Texas 
Tesla Stock Outlook: Strong EV Sales Boost Earnings, but AI Projects Drive Long-Term Value 
Belimo H1 Sales Surge as AI Data Center Cooling Drives More Than Half of Growth 
Hyundai Takes Full Control of Boston Dynamics to Accelerate Humanoid Robot and AI Strategy 
Nvidia Reveals 9.3% Stake in AI Cloud Firm Nebius Following $2 Billion Investment 
Samsung Electronics, the global memory chip leader, has begun mass-producing its latest automotive chip, UFS 3.1, designed specifically for in-vehicle infotainment (IVI) systems. With advanced features and improved energy efficiency, Samsung sets its sight on usurping market leader Micron Technology Inc. by 2025.
The South Korean tech giant has set an ambitious target of surpassing Micron Technology Inc., the current market leader, by 2025 with this cutting-edge vehicle chip. To cater to diverse customer needs, the new flash memory will be available in three capacity options: 128GB, 256GB, and 512GB, according to Samsung's statement. Furthermore, the energy consumption of the 256GB model has decreased by approximately one-third as compared to its predecessor.
The 256GB UFS 3.1 chip impressively offers a sequential write speed of 700 megabytes per second (MB/s) and a sequential read speed of 2,000 MB/s, as highlighted in Samsung's announcement. By introducing the UFS 3.1 chip, Samsung aims to fulfill a wide range of customer requirements and enhance IVI systems. Additionally, the chip adheres to the emerging memory trend that demands higher ESG standards, emphasized Cho Hyun-duk, vice president of Samsung's memory product planning team. Cho also expressed Samsung's intention to cement its presence in the automotive semiconductor market by introducing the UFS 3.1 solution for advanced driver assistance systems (ADAS).
With plans to commence supplying UFS 3.1 products to global automakers and parts manufacturers by the end of this year, Samsung looks ahead to mass production of 512GB UFS 3.1 chips in the fourth quarter. As an assurance of stable performance within the temperature range of minus 40 degrees Celsius to 105 degrees Celsius, the latest auto chip complies with the AEC-Q 100 Grade 2, a semiconductor quality standard for vehicles, according to the company.
Samsung's commitment to strengthening its automotive memory portfolio has gained recognition. In April, the company received an ASPICE Level 2 certification from customers, while the UFS 3.1 chip's performance stability was recently certified by C&BIS, a renowned automobile verification agency.
Since entering the automotive memory chip business in 2015, Samsung has continuously bolstered its high-tech chip lineup, driven by global carmakers' rapid adoption of autonomous and IVI systems, which has stimulated the demand for advanced auto chips. Market research firm Omdia predicts that the global auto chip market will experience substantial growth, reaching $96.2 billion by 2026 from $63.5 billion in 2022.
Photo: Samsung Newsroom
